Dimensity 1300 is now official as MediaTek’s new high-performance chipset. Here are all the details.
Dimension 1300 has just been announced! MediaTek has just unveiled the successor to last year’s popular Dimensity 1200 chipset. This chipset is expected to offer a mild performance upgrade over its predecessor and should be in line with the Snapdragon 778G chipset that powers most mid-range Android smartphones. MediaTek has yet to announce which phones will get the chipset first, but rumors suggest a OnePlus device gets it sooner than anyone else.
The Dimensity 1300 is based on TSMC’s 6nm manufacturing process and features an octa-core processor, consisting of the same 1+3+4 configuration. The Ultra Cortex-A78 core runs at 3GHz, while the normal performance cores run at 2.6GHz. The four efficient Cortex-A55 cores run at 2GHz. MediaTek uses a 9-core Mali-G77 MC9 GPU, which should offer improved performance.
Dimension 1300 is here
MediaTek says the Dimensity 1300 can support an FHD+ display with a refresh rate of up to 168Hz. The chip can support up to 16 GB of LpDDR4X RAM and UFS 3.1 storage. The ISP can support a camera sensor with a resolution of up to 200 MP and can also shoot 4K HDR videos. And of course it supports 5G networks.
“The Dimensity 1300 increases the AI benchmark scores of the six-core APU 3.0 by up to 10%, providing more capacity for AI tasks. The MediaTek APU 3.0 features an advanced multitasking scheduler to maximize performance and efficiency while handling a wide variety of concurrent tasks,” said MediaTek.
“MediaTek HyperEngine 5.0 offers a comprehensive suite of gaming-related optimizations, such as exclusive AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, plus wireless earbud latency improvements from Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio,” adds MediaTek. please .
And just like last year, MediaTek has opened it up to manufacturers to customize the chip to their specific needs. “Dimensity 5G Open Resource Architecture enables device makers to create unparalleled 5G smartphones that truly stand out,” the press release said.
As the Dimensity 1300 breaks cover, there are reports of the Dimensity 8000 series chips being made in global markets including India in the new Xiaomi 12 series devices. In addition, there have been reports of Samsung Considering MediaTek chips for the upcoming Galaxy S22 FE and Galaxy S23 series devices in several Asian markets in a bid to keep prices low.